Description

Job Description Overview:

The Thermal / Mechanical System Architect is responsible for architecting the system level thermal and mechanical design for our NUC products, which includes the system enclosure, thermal module, and physical interfacing. This is a key leadership role in defining and resolving system level challenges from early concepts and mock-ups through to final production. The ideal candidate will have experience in PC chassis and/or thermal module architecture and design and have a passion for inventing and working on new product innovations and rapid prototyping.

Essential Duties and Responsibilities:

• Leading the system-level and component-level thermal and mechanical conceptual design across various small form factor systems and throughout the product life cycle.
• Defining system architecture for new products, while balancing performance, system-level acoustics, cost, and schedule requirements.
• Creating ground-up 3D models and renderings based on the team’s vision for the product, clearly supporting the expected system performance and aesthetics.
• Creatively solving challenging thermal scenarios in high-density (high wattage per unit volume) systems to drive new system-level innovations
• Designing and running thermal and heat-flow simulations, using standard industry-leading tools, to better inform early design ideas and partner feedback
• Creating, fabricating, and validating ground-up system mock-ups and prototypes as part of advanced system planning
• Reviewing and refining ODM/supplier thermomechanical design proposals to ensure that they deliver the best performing solutions to meet the project needs
• Validating physical designs and components, including hands-on testing of samples
• Implementing and validating platform thermal management systems
• Tuning the final thermal and power management subsystem for optimal system performance and acoustics, which may include fan table configuration, dynamic system sensing and response, etc.
• Drive the resolution of various thermomechanical-related issues throughout the product life cycle
• Working on-site in a lab environment and meeting regularly with partners in Asia time zones

Knowledge and Skills:

• Advanced proficiency in MCAD design tools (e.g., Creo, Solidworks).
• Knowledge of materials, structural, stress, acoustic, EMI/RFI, vibration, and industry standards is a plus.
• Working experience and proficiency in injection molding, CNC, extrusions, and sheet metal fabrication processes.
• A proven and advanced understanding of Design for Manufacturability (DFM), Serviceability, Sustainability, and other DFx best practices.
• Experience designing passive and active thermal solutions based on a variety of PC cooling technologies (including air and liquid cooled systems, heat pipes and vapor chambers, modern thermal interface materials, etc.)
• Proficiency in standard thermomechanical tools, such as Flotherm
• Demonstrated knowledge of acoustic noise management in PC systems
• Experience working, and achieving results, through external ODM partners and/or suppliers
• Ability to work confidently in a rapidly changing, fast-paced and results-oriented corporate environment where a high degree of flexibility is required
• Excellent written and verbal communication skills in English

Required Qualifications:

Education & Work Experience

• Bachelor’s degree in mechanical engineering (or equivalent).
• 5+ years of thermal and/or mechanical engineering in the computer industry.
• 5+ years of experience working with PC ODMs and/or other technology suppliers to deliver commercially viable products.
• Demonstrated understanding of advanced thermomechanical architecture as relates to PC or server system design.
• Demonstrated working knowledge of industry-standard thermomechanical development tools.
• Demonstrated experience with complex troubleshooting and system debug skills.

Preferred Qualifications:

• Experience developing Mini PC (sub 3L) Systems for commercial and consumer applications
• Familiarity with Intel Turbo Boost Technology and its implementation
• Familiarity with Intel DPTF/DTT/IPF policies and their implementation
• Understanding of thermal ergonomics and safety regulations
• Knowledge of system-level design and manufacturing processes
• Understanding of system and component reliability testing
• Experience leading next generation product or technology planning.

Working Conditions:

• Typically works in a lab environment doing hands-on work with prototype systems, etc.
• Requires sitting, operating a computer keyboard, telephone and other office equipment for extended periods of time.
• Weekly interaction with Asia-based colleagues and design partners in calls and meetings scheduled beyond typical core working hours (PST).
• Occasional travel to visit ODMs or suppliers (in Asia) may be required (approx. 4%).